FC-BGA（ABF）
Product features
number of plies : 2+n+2 ~ 6+n+6 Layers
slab thickness: 0.3 mm~2.4 mm
Package size from8 x 8 mm till/extremely 70 x 70 mm
Line width/line spacing：min.9/12 μm
Blind hole diameter/ Land: 45 / 75 μm
Minimum bump span 110 μm
product application
Use computer CPU / GPU
High speed operation HPC / AI
Server/switch
Infrastructure such as 5G Netcom and base station
ASIC chip
Automotive chip ADAS / Infotainment
