FC-BGA（BT）
Product features
number of plies : 1+n+1 ~ 3+n+3 Layers
slab thickness: 0.3 mm~1.2 mm
Package size from8 x 8 mm till/extremely 40 x 40 mm
Line width/line spacing：min.15/15 μm
Blind hole diameter/ Land: 55 / 85 μm
Minimum bump span 125 μm
product application
Use computerCPU / GPU
High speed operation HPC / AI
Server/switch
Infrastructure such as 5G Netcom and base station
ASIC chip
Automotive chip ADAS / Infotainment
