FCCSP - ETS substrate
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ETS

      Product features

  • Number of layers: 2, 3, 4, 5 Layers

  • Plate thickness: 0.1mm~0.3mm

  • Embedded trace: min. 7/7 um

  • Blind hole diameter/ Land: 55 / 85 μm

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      product application

  • Internet of things mobile device

  • Wearable device

  • Bitcoin mining machine chip

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