In order to meet the design requirements of new generation chips such as smart phones and other portable smart products, consumer electronics products, 5G related applications, high pin count, good electrical requirements, etc., apart from the traditional Build-up process, Core Love also provides a non-core carrier board and an embedded circuit ETS carrier board, providing flexible layer selection and thin circuit products. • FCCSP - Coreless • FCCSP – Build up I/O leads of FC-BGA package can be arrayed on the surface of the chip, which not only has higher density I/O arrangement, but also has the advantages of low loss, low inductance, low electromagnetic interference, etc. Core akg can also provide ABF or BT base FCBGA carrier for customers to have more choices. |
